- Package / Case :
-
- 100-LQFP Exposed Pad (2)
- 28-SOIC (0.295", 7.50mm Width) (1)
- 30-WFBGA, CSPBGA (2)
- 30-WFBGA, FCBGA (1)
- 36-BFSOP (0.295", 7.50mm Width) Exposed Pad (8)
- 36-BSSOP (0.433", 11.00mm Width) Exposed Pad (3)
- 36-PowerBFSOP (0.295", 7.50mm Width) (1)
- 36-PowerFSOP (0.295", 7.50mm Width) (3)
- 44-LQFP (1)
- 48-VFQFN Exposed Pad (3)
- 56-VFQFN Exposed Pad (1)
- 64-LQFP (10)
- 64-LQFP Exposed Pad (2)
- Series :
- Packaging :
- Operating Temperature :
- Part Status :
- Applications :
- Interface :
- Specifications :
- Applied Filters :
38 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Package / Case | Series | Packaging | Number of Channels | Function | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Applications | Interface | Specifications | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
VIEW | STMicroelectronics | IC AUDIO PROCESSOR DGTL 64-TQFP | 64-LQFP | DDX™ | Tray | 8 | Fully Integrated Processor | -40°C ~ 125°C (TJ) | Obsolete | 3 V ~ 3.6 V | 64-TQFP (10x10) | Pre-Amplifier | I²C, I²S | Direct Digital Amplification | ||||
|
VIEW | STMicroelectronics | IC AUDIO SYSTEM DGTL 36PWRSSO | 36-BFSOP (0.295", 7.50mm Width) Exposed Pad | Sound Terminal™ | Tube | 2 | Fully Integrated Processor | -20°C ~ 85°C (TA) | Obsolete | 5 V ~ 26 V | PowerSSO-36 | Pre-Amplifier | I²C, I²S | Full Flexible Amplification | ||||
|
VIEW | STMicroelectronics | IC AUDIO PROCESSOR DGTL 64-TQFP | 64-LQFP | DDX™ | Tape & Reel (TR) | 8 | Fully Integrated Processor | -40°C ~ 125°C (TJ) | Obsolete | 3 V ~ 3.6 V | 64-TQFP (10x10) | Pre-Amplifier | I²C, I²S | Direct Digital Amplification | ||||
|
VIEW | STMicroelectronics | IC AUDIO SYSTEM DGTL 4CH 64-LQFP | 64-LQFP Exposed Pad | Sound Terminal™ | Tape & Reel (TR) | 4 | Fully Integrated Processor | 0°C ~ 70°C (TA) | Obsolete | 2.5 V ~ 3.6 V | 64-LQFP-EP (10x10) | Pre-Amplifier | I²C, I²S | Full Flexible Amplification | ||||
|
VIEW | STMicroelectronics | IC DAS 2.1CH HI EFF POWERSO36 | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | DDX™ | Cut Tape (CT) | 2 | Fully Integrated Processor | -40°C ~ 125°C (TJ) | Obsolete | 10 V ~ 36 V | PowerSO-36 | Pre-Amplifier | I²C, I²S | Direct Digital Amplification | ||||
|
VIEW | STMicroelectronics | IC AUD PROCESSOR 2.1MULTI 28SOIC | 28-SOIC (0.295", 7.50mm Width) | - | Tape & Reel (TR) | 3 | Fully Integrated Processor | -20°C ~ 125°C (TJ) | Obsolete | 3 V ~ 3.6 V | 28-SO | Pre-Amplifier | I²C, I²S | Direct Digital Amplification | ||||
|
VIEW | STMicroelectronics | IC PROCESSOR AM/FM DGTL 100-TQFP | 100-LQFP Exposed Pad | - | Tape & Reel (TR) | 6 | Fully Integrated Processor | -40°C ~ 125°C (TJ) | Obsolete | 3.15 V ~ 3.45 V | 100-TQFP-EP (14x14) | Digital Audio Interfacing | I²C, SPI | AM, FM | ||||
|
VIEW | STMicroelectronics | IC PROCESSOR AM/FM DGTL 100-TQFP | 100-LQFP Exposed Pad | - | Tray | 6 | Fully Integrated Processor | -40°C ~ 125°C (TJ) | Obsolete | 3.15 V ~ 3.45 V | 100-TQFP-EP (14x14) | Digital Audio Interfacing | I²C, SPI | AM, FM | ||||
|
VIEW | STMicroelectronics | IC AUDIO PROCESSOR DGTL 64-TQFP | 64-LQFP | DDX™ | Tray | 8 | Fully Integrated Processor | -40°C ~ 125°C (TJ) | Obsolete | 3 V ~ 3.6 V | 64-TQFP (10x10) | Pre-Amplifier | I²C, I²S | Direct Digital Amplification | ||||
|
VIEW | STMicroelectronics | IC AUDIO PROCESSOR DGTL 64-TQFP | 64-LQFP | DDX™ | Tray | 8 | Fully Integrated Processor | -40°C ~ 125°C (TJ) | Obsolete | 3 V ~ 3.6 V | 64-TQFP (10x10) | Pre-Amplifier | I²C, I²S | Direct Digital Amplification | ||||
|
VIEW | STMicroelectronics | IC PROCESSOR AUD DGTL DDX 64TQFP | 64-LQFP | DDX™ | Tape & Reel (TR) | 8 | Fully Integrated Processor | -40°C ~ 125°C (TJ) | Obsolete | 3 V ~ 3.6 V | 64-TQFP (10x10) | Pre-Amplifier | I²C, I²S | Direct Digital Amplification | ||||
|
VIEW | STMicroelectronics | IC PROCESSOR AUD DGTL DDX 64TQFP | 64-LQFP | DDX™ | Tape & Reel (TR) | 6 | Fully Integrated Processor | -20°C ~ 125°C (TJ) | Obsolete | 3 V ~ 3.6 V | 64-TQFP (10x10) | Pre-Amplifier | I²C, I²S | Direct Digital Amplification | ||||
|
VIEW | STMicroelectronics | IC PROCESSOR AUD DGTL DDX 44TQFP | 44-LQFP | DDX™ | Tray | 6 | Fully Integrated Processor | -20°C ~ 125°C (TJ) | Obsolete | 3 V ~ 3.6 V | 44-TQFP (10x10) | Pre-Amplifier | I²C, I²S | Direct Digital Amplification | ||||
|
VIEW | STMicroelectronics | IC AUDIO SYSTEM 2.1 48-VQFN | 48-VFQFN Exposed Pad | Sound Terminal™ | Tray | 2 | Fully Integrated Processor | 0°C ~ 70°C (TA) | Active | 4.5 V ~ 25.5 V | 48-VQFN (7x7) | Pre-Amplifier | I²C, I²S | Full Flexible Amplification | ||||
|
VIEW | STMicroelectronics | IC AUDIO SYSTEM DGTL 36POWERSOIC | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | - | Tape & Reel (TR) | 2 | Fully Integrated Processor | -40°C ~ 125°C (TJ) | Active | 8 V ~ 36 V | PowerSO-36 | Pre-Amplifier | I²C, I²S | Direct Digital Amplification | ||||
|
VIEW | STMicroelectronics | IC AUDIO PROCESSOR 8CHAN TQFP64 | 64-LQFP | - | Tray | 8 | Fully Integrated Processor | -40°C ~ 125°C (TJ) | Active | 3 V ~ 3.6 V | 64-TQFP (10x10) | Pre-Amplifier | I²C, I²S | Full Flexible Amplification | ||||
|
VIEW | STMicroelectronics | IC AUDIO SYSTEM DGTL 36PWRSSO | 36-BFSOP (0.295", 7.50mm Width) Exposed Pad | Sound Terminal™ | Tape & Reel (TR) | 2 | Fully Integrated Processor | -20°C ~ 85°C (TA) | Active | 5 V ~ 26 V | PowerSSO-36 | Pre-Amplifier | I²C, I²S | Full Flexible Amplification | ||||
|
VIEW | STMicroelectronics | IC AUDIO SYSTEM 2.1 48-VQFN | 48-VFQFN Exposed Pad | Sound Terminal™ | Tape & Reel (TR) | 2 | Fully Integrated Processor | 0°C ~ 70°C (TA) | Obsolete | 4.5 V ~ 26 V | 48-VQFN (7x7) | Pre-Amplifier | I²C, I²S | Full Flexible Amplification | ||||
|
VIEW | STMicroelectronics | IC AUDIO SYS DGTL 2.1CH PWRSSO36 | 36-PowerFSOP (0.295", 7.50mm Width) | Sound Terminal™ | Tape & Reel (TR) | 2 | Fully Integrated Processor | -20°C ~ 70°C (TA) | Active | 4.5 V ~ 21.5 V | PowerSSO-36 EPD | Pre-Amplifier | I²C, I²S | Full Flexible Amplification | ||||
|
7,500
In-stock
|
STMicroelectronics | IC AUDIO SYS DGTL 2.1CH PWRSSO36 | 36-PowerBFSOP (0.295", 7.50mm Width) | - | Tape & Reel (TR) | 2 | Fully Integrated Processor | -20°C ~ 70°C (TA) | Active | 5 V ~ 26 V | PowerSSO-36 | Pre-Amplifier | I²C, I²S | Full Flexible Amplification | ||||
|
VIEW | STMicroelectronics | IC AUDIO SYS DGTL 2.1CH PWRSSO36 | 36-BFSOP (0.295", 7.50mm Width) Exposed Pad | Sound Terminal™ | Tape & Reel (TR) | 2 | Fully Integrated Processor | -20°C ~ 70°C (TA) | Active | 4.5 V ~ 21.5 V | PowerSSO-36 EPD | Pre-Amplifier | I²C, I²S | Full Flexible Amplification | ||||
|
VIEW | STMicroelectronics | IC AUDIO SYS DGTL 2.1CH PWRSSO36 | 36-BFSOP (0.295", 7.50mm Width) Exposed Pad | Sound Terminal™ | Tape & Reel (TR) | 2 | Fully Integrated Processor | -20°C ~ 85°C (TA) | Active | 5 V ~ 26 V | PowerSSO-36 EPD | Pre-Amplifier | I²C, I²S | Full Flexible Amplification | ||||
|
VIEW | STMicroelectronics | SOUND TERMINAL 2.1-CHANNEL HIGH- | 36-PowerFSOP (0.295", 7.50mm Width) | Sound Terminal™ | - | 2 | Fully Integrated Processor | -20°C ~ 85°C (TA) | Active | 5 V ~ 26 V | PowerSSO-36 | Pre-Amplifier | I²C, I²S | Full Flexible Amplification | ||||
|
VIEW | STMicroelectronics | SOUND TERMINAL 2.1-CHANNEL HIGH- | 36-PowerFSOP (0.295", 7.50mm Width) | Sound Terminal™ | - | 2 | Fully Integrated Processor | -20°C ~ 85°C (TA) | Active | 5 V ~ 26 V | PowerSSO-36 | Pre-Amplifier | I²C, I²S | Full Flexible Amplification | ||||
|
VIEW | STMicroelectronics | IC DAS 2.1 CHANNEL POWERSSO36 | 36-BFSOP (0.295", 7.50mm Width) Exposed Pad | Sound Terminal™ | Tape & Reel (TR) | 2 | Fully Integrated Processor | -20°C ~ 70°C (TA) | Active | 4.5 V ~ 16 V | PowerSSO-36 EPD | Pre-Amplifier | I²C, I²S | Full Flexible Amplification | ||||
|
VIEW | STMicroelectronics | IC DAS 1CH SOUND POWERSSO36 | 36-BFSOP (0.295", 7.50mm Width) Exposed Pad | Sound Terminal™ | Tape & Reel (TR) | 2 | Fully Integrated Processor | -20°C ~ 70°C (TA) | Active | 4.5 V ~ 21.5 V | PowerSSO-36 EPD | Pre-Amplifier | I²C, I²S | Full Flexible Amplification | ||||
|
VIEW | STMicroelectronics | IC DAS 2CH MICROLESS FLIPCHIP | 30-WFBGA, FCBGA | Sound Terminal™ | Tape & Reel (TR) | 2 | Fully Integrated Processor | 0°C ~ 70°C (TA) | Active | 4.5 V ~ 18 V | FlipChip 30 | Pre-Amplifier | I²S | Full Flexible Amplification | ||||
|
VIEW | STMicroelectronics | IC DAS 2CH MICROLESS FLIPCHIP | 30-WFBGA, CSPBGA | Sound Terminal™ | Tape & Reel (TR) | 2 | Fully Integrated Processor | 0°C ~ 70°C (TA) | Active | 4.5 V ~ 18 V | 30-CSP (3.24x2.57) | Pre-Amplifier | I²S | Full Flexible Amplification | ||||
|
VIEW | STMicroelectronics | IC DAS 2CH MICROLESS CSP | 30-WFBGA, CSPBGA | Sound Terminal™ | Tape & Reel (TR) | 2 | Fully Integrated Processor | 0°C ~ 70°C (TA) | Active | 4.5 V ~ 20 V | - | Pre-Amplifier | I²S | Direct Digital Amplification | ||||
|
VIEW | STMicroelectronics | IC AUDIO SYSTEM 2.1 36POWERSOIC | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | - | Tape & Reel (TR) | 2 | Fully Integrated Processor | -40°C ~ 125°C (TJ) | Active | 10 V ~ 36 V | PowerSO-36 EPU | Pre-Amplifier | I²C, I²S | Direct Digital Amplification |